Integrated interconnect technologies for 3D nanoelectronic systems / Muhannad S. Bakir, James D. Meindl, editors.
نوع المادة : نصالسلاسل:Artech House integrated microsystems seriesالناشر:Boston, Mass. ; London : Artech House, [2009]تاريخ حقوق النشر: ©2009وصف:xx, 528 pages : illustrations ; 26 cmنوع المحتوى:- text
- unmediated
- volume
- 9781596932463
- 1596932465
- TK7874.53 .I56 2009
نوع المادة | المكتبة الحالية | رقم الطلب | رقم النسخة | حالة | تاريخ الإستحقاق | الباركود | |
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كتاب | UAE Federation Library | مكتبة اتحاد الإمارات General Collection | المجموعات العامة | TK7874.53 .I56 2009 (إستعراض الرف(يفتح أدناه)) | C.1 | Library Use Only | داخل المكتبة فقط | 30020000012766 |
Browsing UAE Federation Library | مكتبة اتحاد الإمارات shelves, Shelving location: General Collection | المجموعات العامة إغلاق مستعرض الرف(يخفي مستعرض الرف)
TK7874 .B4712 2010 تكنولوجيا الدوائر الاليكترونية / | TK7874 .B4712 2010 تكنولوجيا الدوائر الاليكترونية / | TK7874 C543 1988 The Chipmakers / | TK7874.53 .I56 2009 Integrated interconnect technologies for 3D nanoelectronic systems / | TK7874.6 .H68 2008 High performance ASIC design : using synthesizable domino logic in an ASIC flow / | TK7874.65 H64 2003 Analysis and design of digital integrated circuits : in deep submicron technology / | TK7874.654 .A5 2013 Analog circuit design. Volume 2, Immersion in the black art of analog design / |
Includes bibliographical references and index.
Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.
Revolutionary silicon auxiliary technologies for the next era of gigascale integration -- Chip-package interaction and reliability impact on Cu/low-k interconnects -- Mechanically compliant I/O interconnects and packaging -- Power delivery to silicon -- On-ship supply noise modeling for gigascale 2D and 3D systems -- Off-chip signaling -- Optical interconnects for chip-to-chip signaling -- Monolithic optical interconnects -- Limits of current heat removal technologies and opportunities -- Active microfluidic cooling of integrated circuits -- Single and 3D chip cooling using microchannels and microfluidic chip I/O interconnects -- Carbon nanotube electrical and thermal properties and applications for interconnects -- 3D integration and packaging for memory -- 3D stacked die and silicon packaging with through-silicon vias, thinned silicon, and silicon-silicon interconnection technology -- Capacitive and inductive-soupling I/Os for 3D chips -- Wafer-level testing of gigascale integrated circuits.