Wafer-level testing and test during burn-in for integrated circuits / Sudarshan Bahukudumbi, Krishnendu Chakrabarty.
نوع المادة : نصالسلاسل:Artech House integrated microsystems seriesالناشر:Boston : Artech House, [2010]تاريخ حقوق النشر: ©2010وصف:xv, 198 pages : illustrations ; 24 cmنوع المحتوى:- text
- unmediated
- volume
- 9781596939899
- 1596939893
- TK7874 .B327 2010
نوع المادة | المكتبة الحالية | رقم الطلب | رقم النسخة | حالة | تاريخ الإستحقاق | الباركود | |
---|---|---|---|---|---|---|---|
كتاب | UAE Federation Library | مكتبة اتحاد الإمارات General Collection | المجموعات العامة | TK7874 .B327 2010 (إستعراض الرف(يفتح أدناه)) | C.1 | Library Use Only | داخل المكتبة فقط | 30020000015436 | ||
كتاب | UAE Federation Library | مكتبة اتحاد الإمارات General Collection | المجموعات العامة | TK7874 .B327 2010 (إستعراض الرف(يفتح أدناه)) | C.2 | المتاح | 30020000015439 |
Includes bibliographical references and index.
Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.