Wafer-level testing and test during burn-in for integrated circuits / Sudarshan Bahukudumbi, Krishnendu Chakrabarty.
نوع المادة :![نص](/opac-tmpl/lib/famfamfam/BK.png)
- text
- unmediated
- volume
- 9781596939899
- 1596939893
- TK7874 .B327 2010
نوع المادة | المكتبة الحالية | رقم الطلب | رقم النسخة | حالة | تاريخ الإستحقاق | الباركود | |
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UAE Federation Library | مكتبة اتحاد الإمارات General Collection | المجموعات العامة | TK7874 .B327 2010 (إستعراض الرف(يفتح أدناه)) | C.1 | Library Use Only | داخل المكتبة فقط | 30020000015436 | ||
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UAE Federation Library | مكتبة اتحاد الإمارات General Collection | المجموعات العامة | TK7874 .B327 2010 (إستعراض الرف(يفتح أدناه)) | C.2 | المتاح | 30020000015439 |
Browsing UAE Federation Library | مكتبة اتحاد الإمارات shelves, Shelving location: General Collection | المجموعات العامة إغلاق مستعرض الرف(يخفي مستعرض الرف)
TK7872.T55 H36 2012 Handbook of thin film deposition : techniques, processes, and technologies / | TK7874 .A3352 1988 Advanced research in VLSI : proceedings of the fifth MIT conference, March 1988 / | TK7874 .A3352 1988 Advanced research in VLSI : proceedings of the fifth MIT conference, March 1988 / | TK7874 .B327 2010 Wafer-level testing and test during burn-in for integrated circuits / | TK7874 .B327 2010 Wafer-level testing and test during burn-in for integrated circuits / | TK7874 .B4712 2010 تكنولوجيا الدوائر الاليكترونية / | TK7874 .B4712 2010 تكنولوجيا الدوائر الاليكترونية / |
Includes bibliographical references and index.
Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.